PCB Assembly and Test
We supply PCBs to local assembly and test facilities specialising in the High Technology High Reliability sector of the market, which can provide assembly and test only or full turn-key services, offering either fast turn prototypes or scheduled production runs.
Capabilities include:
- BGA, micro BGA, CSP and 0402, 0201
- BGA processing to 0.2mm pitch.
- BGA's up to 1580 balls, 55 x 55
- TAB and wire bonding.
- Mixed SMT and through hole assembly.
- Backplane capabilities (SMT, press-fit, wave)
- Largest SMT assembled backplane 7.3 mm thick, 610 x 533 mm.
- RoHS compliant and Non-RoHS compliant.
- NDA, ICT and functional test.
Should you require any futher information please Contact Us